EPON 872X75

EPON™ Resin 872-X-75 is a 75% by weight solution of EPON 872 in xylene. EPON 872 is a chemically-modified BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 872-X-75 can be combined with other EPON Resins, HELOXY™ Modifiers, or used as the sole resin to provide varying degrees of flexibility and toughness. EPON Resin 872-X-75 can be used with most curing agent types. EPON Resin 872-X-75 provides cured resin toughness and flexibility in comparison to liquid grade BPA epoxies, but reduces elevated temperature performance. EPON Resin 872-X-75 is especially useful in applications requiring extra thermal shock or impact resistance.